发明名称 |
METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES |
摘要 |
A method for fabricating printed electronics includes printing (102) a trace of an electrical component on a first substrate to form a first layer (110). The method further includes printing a trace of an electrical component on at least one additional substrate to form at least one additional layer (106). The first layer is stacked (112) with the at least one additional layer to create an assembled electrical device. At least one of the layers is modified (104) after printing. |
申请公布号 |
EP2966945(A1) |
申请公布日期 |
2016.01.13 |
申请号 |
EP20150173294 |
申请日期 |
2015.06.23 |
申请人 |
HAMILTON SUNDSTRAND CORPORATION |
发明人 |
CULP, SLADE R.;DARDONA, SAMEH;SCHMIDT, WAYDE R. |
分类号 |
H05K1/09;H05K1/16;H05K3/46 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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