发明名称 FILM FORMING DEVICE, FILM FORMING METHOD AND STORAGE MEDIUM
摘要 PROBLEM TO BE SOLVED: To provide film forming device and method that can obtain oxide film having excellent properties without any heating mechanism for heating a board and prevent excessive increase of the pressure in a treatment container when oxide film is formed on the board.SOLUTION: A film forming device is configured so that a board is alternately and repetitively located at each of a first area and a second area by rotating a table relatively to the first and second areas. Raw material gas is supplied to the first area, and a treatment space forming member is moved upwards and downwards relatively to the table in the second area. Environment gas containing ozone is supplied in the treatment space constructed by the treatment space forming member, and energy is supplied to the treatment space so that ozone is forced to be decomposed. The raw material is oxidized by the decomposition of ozone. A partition mechanism for switching the treatment space between a state where the treatment space intercommunicates with a buffer area supplied with inert gas and a state where the treatment space is partitioned from the buffer area is provided, whereby increase of the pressure of the treatment space under the decomposition can be suppressed.
申请公布号 JP2016004866(A) 申请公布日期 2016.01.12
申请号 JP20140123514 申请日期 2014.06.16
申请人 TOKYO ELECTRON LTD 发明人 YABE KAZUO;SHIMIZU AKIRA
分类号 H01L21/31;C23C16/40;C23C16/42;C23C16/455;H01L21/316 主分类号 H01L21/31
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