PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE

摘要

The present invention provides a printed circuit board for a semiconductor package which can improve thermal cycle reliability and drop reliability at the same time. The printed circuit board includes: a printed circuit board body; multiple ball lands formed on one surface of the printed circuit board body; a first plating layer formed on a part on each of the ball lands; and a second plating layer formed on a different part on each of the ball lands. Upper surfaces of the first plating layer and the second plating layer are coplanar.