发明名称 |
Silicon carbide single crystal wafer and manufacturing method for same |
摘要 |
Provided are a method for manufacturing a SiC single crystal having high crystal quality and, in particular, extremely low screw dislocation density and a SiC single crystal ingot obtained by the method. In particular, provided is a silicon carbide single crystal substrate that is a substrate cut from a bulk silicon carbide single crystal grown by the Physical Vapior Transport (PVT) method, in which the screw dislocation density is smaller in the peripheral region than in the center region, so that screw dislocations are partially reduced.;The method is a method for manufacturing a SiC single crystal by the PVT method using a seed crystal and the ingot is a SiC single crystal ingot obtained by the method. Particularly, the silicon carbide single crystal substrate is a silicon carbide single crystal substrate in which when, by representing the diameter of the substrate as R, a center circle region having a diameter of 0.5×R centered around a center point O of the substrate and a doughnut-shaped peripheral region remaining by excluding the center circle region are defined, the average value of screw dislocation densities observed in the doughnut-shaped peripheral region is 80% or less of the average value of screw dislocation densities observed in the center circle region. |
申请公布号 |
US9234297(B2) |
申请公布日期 |
2016.01.12 |
申请号 |
US201214241623 |
申请日期 |
2012.08.29 |
申请人 |
NIPPON STEEL & SUMITOMO METAL CORPORATION |
发明人 |
Sato Shinya;Fujimoto Tatsuo;Tsuge Hiroshi;Katsuno Masakazu |
分类号 |
B32B3/02;C30B23/02;C30B29/36;C30B23/00;H01L29/16 |
主分类号 |
B32B3/02 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A silicon carbide single crystal substrate that is a disk-shaped silicon carbide single crystal substrate cut from a bulk SiC single crystal grown by the Physical Vapor Transport (PVT) method, the silicon carbide single crystal substrate being characterized in that when, by representing the diameter of the substrate as R, a center circle region having a diameter of 0.5×R centered around a center point O of the substrate and a doughnut-shaped peripheral region remaining by excluding the center circle region of the substrate are defined, the average value of screw dislocation densities observed in the doughnut-shaped peripheral region is 80% or less of the average value of screw dislocation densities observed in the center circle region. |
地址 |
Tokyo JP |