Composite bi-stable device

摘要

A deformable bi-stable device includes an elastically deformable member having at least two stable configurations and capable of being deformed from a first stable configuration to a second stable configuration, the element passing through an unstable configuration as it is deformed from the first stable configuration to the second stable configuration, and a shape memory polymer layer on or in the elastically deformable member. A method of using this device includes heating the shape memory polymer to a temperature sufficient to reduce the modulus of the shape memory polymer, deforming the deformable member to move from one of the first and second stable configurations to another of the first and second stable configurations, and cooling the device to a temperature sufficient to increase the modulus of the shape memory polymer.

主权项

1. A method of operating a deformable bi-stable composite device that comprises an elastically deformable member and a layer comprising a shape memory polymer on or in the elastically deformable member, the composite device having at least two stable configurations and capable of being deformed from a first stable configuration of minimal potential energy to a second stable configuration of minimal potential energy, said composite device passing through an unstable configuration of peak potential energy as it is deformed from the first stable configuration to the second stable configuration, the method comprising:
heating the shape memory polymer to a temperature sufficient to reduce the modulus of the shape memory polymer; elastically deforming the elastically deformable member with external force applied to the composite device while the shape memory polymer is in the reduced-modulus state to move the device from one of the first and second stable configurations to another of the first and second stable configurations; and cooling the device to a temperature sufficient to increase the modulus of the shape memory polymer.