THERMOSETTING EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition that has excellent heat resistance and tracking resistance and is low in water absorption, and a printed wiring board.SOLUTION: An epoxy resin composition comprises epoxy resin 100 pts.wt., aromatic diamine 1-10 pts.wt., dicyandiamide 0.5-2.2 pts.wt., inorganic filler 30-200 pts.wt. comprising boehmite and/or barium sulfate, and curing accelerator 0.05-1.0 pt.wt. A prepreg and a printed wiring board are made using the epoxy resin composition.