WIRING BOARD, PACKAGE AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a wiring board and a package, which include a via conductor of good conduction and which can maintain airtightness; and provided an electronic apparatus including the wiring board or the package.SOLUTION: A wiring board comprises: a substrate 5 having a mounting surface 3 of an electronic component 21 on one principal surface; a hole 7 which pierces the substrate 5 in a thickness direction; and a via conductor 9 provided in the hole 7. The via conductor 9 includes a composite 13 composed of a metal component and a ceramic component, which has a spongiform structure in a state of adhering to an inner wall of the hole 7, and each of cavities 15 existing in a mixed manner with the composite 13 is in a state of a closed pore.