| 摘要 |
PROBLEM TO BE SOLVED: To provide a package device and a method for manufacturing the same.SOLUTION: A package device includes a first conductor layer, a first conductive pillar layer, a dielectric material layer, a second conductor layer, a second conductive pillar layer, and a first molding compound layer. The first conductor layer includes a first surface and a second surface facing each other in a back-to-back manner. The first conductive pillar layer is installed on the first surface of the first conductor layer. The first conductor layer and the first conductive pillar layer are fitted in the dielectric material layer. The second conductor layer is installed on the first conductive pillar layer and the dielectric material layer. The second conductive pillar layer is installed on the second conductor layer. The second conductor layer and the second conductive pillar layer are fitted in the first molding compound layer. |
