Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components

摘要

A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

主权项

1. A method of filling a through hole in a glass substrate, said method comprising:
a. coating a sidewall of the hole with at least one layer of coating material, wherein the coating is parallel to the direction of the through hole, wherein the coating material comprises an organometallic compound or a glass rich paste; and b. metallizing the hole with a paste material, wherein the paste material comprises a metal, a glass frit composition, a solvent, a resin, and a non-conductive inert additive.