Light emitting diodes with enhanced thermal sinking and associated methods of operation

摘要

Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.

主权项

1. A light emitting diode (LED) device, comprising:
a substrate including a heat sink; an LED die thermally coupled to the heat sink; a phosphor spaced apart from the LED die; a heat conduction path in direct contact with both the phosphor and the heat sink, the heat conduction path being configured to conduct heat from the phosphor to the heat sink; and a plurality of vias positioned in the phosphor, wherein individual vias include a conductive material, and wherein the conductive material forms a portion of the heat conduction path.