CIRCUIT SUBSTRATE AND PROCESS FOR PREPARING THE SAME

摘要

The present invention relates to a process for preparing a bonding sheet for composing circuit substrate, comprising pre-treating glass fabrics with a pre-treating varnish having a same or close dielectric constant (DK) to glass fabrics being used. The present invention further relates to bonding sheets prepared by the process, as well as circuit substrate. The process for preparing circuit substrate of the invention, which has a lower cost, does not need to upgrade or adjust the equipment. The circuit substrates prepared thereby have less warp-wise and weft-wise difference in dielectric constant, and thus can effectively solve the problem of signal time delay.

主权项

1. A process for preparing a bonding sheet for composing circuit substrate, comprising the steps of
(1) preparing a pre-treating varnish having a same or close dielectric constant (DK) to reinforcing material being used; (2) pre-glue-dipping the reinforcing material in the pre-treating varnish, and oven-drying solvent to obtain a pre-treated reinforcing material; and (3) main-glue-dipping the pre-treated reinforcing material, and oven-drying solvent to obtain a bonding sheet.