HIGH K DIELECTRIC COMPOSITION FOR THERMOFORMABLE CAPACITIVE CIRCUITS

摘要

This invention is directed to a polymer thick film thermoformable dielectric composition with a high dielectric constant. Dielectrics made from the composition can be used in various electronic applications to enhance the performance of thermoformable capacitive circuits.

主权项

1. A polymer thick film high-K thermoformable dielectric composition comprising:
(a) 15-50 wt % of a first organic medium comprising 10-50 wt % urethane resin dissolved in 50-90 wt % first organic solvent, wherein the weight percent of the urethane resin and the first organic solvent are based on the total weight of the first organic medium; and (b) 15-50 wt % of a second organic medium comprising 10-50 wt % thermoplastic phenoxy resin in 50-90 wt % second organic solvent wherein the weight percent of the thermoplastic phenoxy resin and the second organic solvent are based on the total weight of the second organic medium; and (c) 1-70 wt % of a powder of a high-K material with a K of at least 40;wherein the wt % of the first organic medium, the second organic medium and the powder of the high-K material are based on the total weight of the dielectric composition.