发明名称 POLISHING DEVICE
摘要 The present invention addresses the problem of providing a diamond polishing device in which a polishing member (3) having a long shape, such as a filamentous shape or a belt shape, is used, and polishing is performed while winding the polishing member (3) around a polishing-member support (4), continuously or intermittently displacing a polishing surface, and using the polishing-member support (4) to press the polishing surface against the surface of a member (1) to be polished, said diamond polishing device being provided with a function enabling the polishing of surfaces in semi-enclosed spaces such as the inner peripheral surfaces of cylindrical members and ring members. This polishing device is characterized by comprising: a polishing member (3) having a long shape; a means (6) which delivers and retrieves the polishing member (3); a polishing-member support (4) for holding the polishing member (3) such that the polishing member (3) is capable of being displaced by winding; a base (5) having the polishing-member support (4) attached thereto; and a pressing means (7) for pressing the base (5) towards a processing surface of a member (1) to be polished. The polishing device is further characterized in that: the base (5) is provided with an extended section (5a) extending in a direction different to the pressing direction; and the polishing-member support (4) is provided to the tip of the extended section (5a).
申请公布号 WO2016002537(A1) 申请公布日期 2016.01.07
申请号 WO2015JP67681 申请日期 2015.06.19
申请人 TOYO SEIKAN GROUP HOLDINGS, LTD. 发明人 SHIROISHI RYOZO;TAKAO KENICHI;YAMAUCHI TAKAHIRO
分类号 B24B21/00 主分类号 B24B21/00
代理机构 代理人
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