| 发明名称 |
Double sided cooling chip package and method of manufacturing the same |
| 摘要 |
A double sided cooling chip package is provided, wherein the package comprises a first heat sink; a second heat sink; a stacked chip arrangement comprising a first electronic chip, a second electronic chip and an interfacing substrate arranged between the first electronic chip and the second electronic chip and comprising electric circuitry on at least one main surface, wherein one of the first electronic chip and the second electronic chip is electrically connected to the electric circuitry of the interfacing substrate; and wherein the first electronic chip is attached to the first heat sink and the second electronic chip is attached to the second heat sink. |
| 申请公布号 |
US2016005675(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201414324537 |
申请日期 |
2014.07.07 |
| 申请人 |
Infineon Technologies AG |
发明人 |
TONG Chong Yee |
| 分类号 |
H01L23/367;H01L25/065;H01L25/00;H01L23/495 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A double sided cooling chip package, comprising:
a first heat sink; a second heat sink; and a stacked chip arrangement comprising a first electronic chip, a second electronic chip and an interfacing substrate arranged between the first electronic chip and the second electronic chip and comprising electric circuitry on at least one main surface, wherein one of the first electronic chip and the second electronic chip is electrically connected to the electric circuitry of the interfacing substrate; and wherein the first electronic chip is attached to the first heat sink and the second electronic chip is attached to the second heat sink. |
| 地址 |
Neubiberg DE |
