发明名称 RESIN COMPOSITION AND RESIN MOLD USING OF THE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition having appropriate strength while keeping heat conduction anisotropy and a resin mold using the resin composition.SOLUTION: A resin composition includes: 20-70 mass% of a thermoplastic resin; 10-50 mass% of a first filler selected from boron nitride or graphite; and 20-60 mass% of a second filler being an inorganic material other than the first filler, the second filler satisfying that a b/a value is 10 or more if the length of the longest axis of the inorganic material is c, the longest length of the longest axis in an orthogonal cross-section is b, and the longest length orthogonal to a longest direction of the orthogonal cross-section is a. A resin mold is molded using the resin composition.
申请公布号 JP2016000788(A) 申请公布日期 2016.01.07
申请号 JP20140121516 申请日期 2014.06.12
申请人 AISIN CHEMICAL CO LTD 发明人 WAKASAYA HIROSHI;ARAFUKA MAKOTO;FURUTA RYOICHI
分类号 C08L101/00;C08K3/04;C08K3/38;C08K7/00 主分类号 C08L101/00
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