发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 A semiconductor device includes a first semiconductor layer, a second semiconductor layer formed over the first semiconductor layer, a gate insulating film contacting the second semiconductor layer, and a gate electrode facing the second semiconductor layer via the gate insulating film. The first semiconductor layer includes an Alxα1-xN layer (α includes Ga or In, and 0<x<1), and the second semiconductor layer includes an Alyα1-yN layer (0≦y<1), in which y of the Alyα1-yN layer forming the second semiconductor layer increases at least in a region under the gate electrode as a position where y is measured approaches the first semiconductor layer.
申请公布号 US2016005846(A1) 申请公布日期 2016.01.07
申请号 US201514829216 申请日期 2015.08.18
申请人 Renesas Electronics Corporation 发明人 OKAMOTO Yasuhiro;NAKAYAMA Tatsuo;INOUE Takashi;MIYAMOTO Hironobu
分类号 H01L29/778;H01L29/205;H01L29/423;H01L29/20 主分类号 H01L29/778
代理机构 代理人
主权项 1. A semiconductor device, comprising: a first semiconductor layer; a second semiconductor layer formed over the first semiconductor layer; a gate insulating film contacting the second semiconductor layer; and a gate electrode facing the second semiconductor layer via the gate insulating film, wherein the first semiconductor layer comprises an Alxα1-xN layer (a comprises Ga or In, and 0<x<1), and the second semiconductor layer comprises an Alyα1-yN layer (0≦y<1), and wherein y of the Alyα1-yN layer forming the second semiconductor layer increases at least in a region under the gate electrode as a position where y is measured approaches the first semiconductor layer.
地址 Tokyo JP