发明名称 ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES
摘要 An electronic assembly that includes a first electronic device. The first electronic device includes a cavity that extends into a back side of the first electronic device. The electronic assembly further includes a second electronic device. The second electronic device is mounted to the first electronic device within the cavity in the first electronic device. In some example forms of the electronic assembly, the first electronic device and the second electronic device are each a die. It should be noted that other forms of the electronic assembly are contemplated where only one of the first electronic device and the second electronic device is a die. In some forms of the electronic assembly, the second electronic device is soldered to the first electronic device.
申请公布号 WO2016003456(A1) 申请公布日期 2016.01.07
申请号 WO2014US45217 申请日期 2014.07.02
申请人 INTEL CORPORATION 发明人 DESHPANDE, NITIN;MAHAJAN, RAVI V.
分类号 H01L23/12;H01L21/52 主分类号 H01L23/12
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