PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

摘要

A method for fabricating a package structure is provided, which includes the steps of: providing a base portion having at least an electronic element embedded therein and at least a positioning unit formed around a periphery of the electronic element, wherein the positioning unit protrudes from or is flush with a surface of the base portion; and forming at least a circuit layer on the surface of the base portion and the electronic element. The circuit layer is aligned and connected to the electronic element through the positioning unit.

主权项

1. A method for fabricating a package structure, comprising the steps of:
providing a base portion having opposite first and second surfaces, wherein at least an electronic element, embedded in the base portion, has an active surface having a plurality of electrode pads and an inactive surface opposite to the active surface, and at least a positioning unit is formed around a periphery of the electronic element and protrudes from or is flush with the first surface of the base portion; and forming at least a circuit layer on the first surface of the base portion and the electronic element, wherein the circuit layer is aligned and connected to the electronic element through the positioning unit.