SELECTIVE COMPONENT BONDING TECHNIQUE

摘要

A method of selectively bonding a component to a substrate prevents glue displacement onto neighboring components. The method entails shortening a section of the perimeter of a mount wall so that the foot of the mount wall contacts the glue without causing substantial displacement. A cure step hardens and holds the shortened foot of the mount wall in a stationary position, while providing a partial bond. Meanwhile the rest of the mount wall that is not located near contact pads on the substrate has a tall foot that extends to the surface of the substrate and is bonded in the usual way. By modifying the component, it is not necessary to modify either the chemistry of the epoxy or the epoxy dispense operation.

主权项

1. A method of selectively bonding a component to a substrate, the method comprising:
fabricating a customized device mount attachable to the component, the customized device mount having a mount wall that includes a tall foot and a short foot, a length difference between the tall foot and the short foot designed to substantially match a selected height of a narrow glue line; dispensing epoxy onto a top surface of the substrate to form a narrow glue line, the narrow glue line having a top surface spaced apart from the substrate at the selected height; aligning the mount wall to the narrow glue line; adhering the mount wall to the substrate so that a lower surface of the short foot contacts the top surface of the narrow glue line; and curing the glue lines.