| 摘要 |
Provided is a photosensitive dry film capable of forming a solder resist layer which has an excellent filling property of underfill and an excellent adhesion property with a mold material. According to the present invention, the photosensitive dry film is a photosensitive dry film including a support film and a photosensitive resin layer formed on one side of the support film, wherein the arithmetic average surface roughness Ra of the side of the support film, on which the photosensitive resin layer is formed, is 50 to 390 nm. |
