ELECTRICAL INTERCONNECTION SYSTEM AND ELECTRICAL CONNECTORS FOR THE SAME

摘要

The present invention provides an electrical interconnection system comprising: a paddle card comprising a plurality of first contact pads positioned on a first surface of the paddle card and a plurality of second contact pads positioned on an opposite second surface of the paddle card; a first wafer comprising a plurality of first conductors each having a first contact portion; and a second wafer comprising a plurality of second conductors each having a second contact portion; wherein the first wafer and the second wafer are assembled together to have the first contact portion and the second contact portion face each other and be able to form a gap therebetween for accommodating at least part of the paddle card; each first contact portion is adapted to be in electrical contact with a corresponding first contact pad and each second contact portion is adapted to be in electrical contact with a corresponding second contact pad when the paddle card is at least partly accommodated in the gap.

主权项

1. An electrical interconnection system comprising:
a paddle card (30) in a plate shape and having a first surface (31) and a back to back second surface (32), comprising a plurality of first contact pads (33) positioned on the first surface (31) of the paddle card (30) and a plurality of second contact pads (34) positioned on the second surface (32) of the paddle card (30); a first wafer (11a) comprising a plurality of first conductors (13a) each having a first contact portion (131a); and a second wafer (11b) comprising a plurality of second conductors (13b) each having a second contact portion (131b); wherein each wafer (11a, 11b) comprises a housing (12) enclosing at least part of the plurality of conductors (13a, 13b) of the wafer (11a, 11b), and each said housing (12) comprises a mounting edge (122) at which the wafer can be mounted onto a printed circuit board (60), and a mating edge (121) at which the contact portions (131a, 131b) are located; wherein the first wafer (11a) and the second wafer (11b) are assembled together to have the first contact portion (131a) and the second contact portion (131b) face each other and be able to form a gap (1310) therebetween for accommodating at least part of the paddle card (30); wherein each first contact portion (131a) is adapted to be in electrical contact with a corresponding first contact pad (33) and each second contact portion (131b) is adapted to be in electrical contact with a corresponding second contact pad (34) when the paddle card (30) is at least partly accommodated in the gap (1310).