发明名称 ポリアミドイミド樹脂、硬化性樹脂組成物及びその硬化物
摘要 Provided are a thermosetting resin composition which is soluble in a general-purpose solvent and which can obtain a cured product (cured film) having high optical transparency to the ultraviolet region (approximately 300 nm) from the visible region, and a polyamide-imide resin suitable for use in preparing the thermosetting resin composition. Specifically, provided are an alcohol-modified polyamide-imide resin, which is obtained by reacting an isocyanurate type polyisocyanate (a1) synthesized from an isocyanate having an aliphatic structure with a tricarboxylic anhydride (a2) to prepare a polyamide-imide resin (a), and then reacting the polyamide-imide resin (a) with an alcohol compound (b); a curable resin composition containing the polyamide-imide resin; and a cured product of the curable resin composition.
申请公布号 JP5839149(B2) 申请公布日期 2016.01.06
申请号 JP20150515302 申请日期 2014.07.15
申请人 DIC株式会社 发明人 村上 晃一;宮垣 敦志
分类号 C08G73/14;C08G18/34;C08L63/00;C08L79/08 主分类号 C08G73/14
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