Stacked-chip imaging systems

摘要

Imaging systems may be provided with stacked-chip image sensors. A stacked-chip image sensor may include a vertical chip stack that includes an array of image pixels, analog control circuitry and storage and processing circuitry. The array of image pixels, the analog control circuitry, and the storage and processing circuitry may be formed on separate, stacked semiconductor substrates or may be formed in a vertical stack on a common semiconductor substrate. The image pixel array may be coupled to the control circuitry using vertical metal interconnects. The control circuitry may route pixel control signals and readout image data signals over the vertical metal interconnects. The control circuitry may provide digital image data to the storage and processing circuitry over additional vertical conductive interconnects coupled between the control circuitry and the storage and processing circuitry. The storage and processing circuitry may be configured to store and/or process the digital image data.

主权项

1. A stacked-chip image sensor, comprising:
a semiconductor substrate having opposing first and second surfaces; an array of image sensor pixels in the semiconductor substrate that are configured to receive image light through the first surface; and control circuitry coupled to the array of image sensor pixels by a plurality of vertical conductive interconnects that extend through the second surface, the array of image sensor pixels comprising image sensor pixels arranged in pixel rows and pixel columns, and the plurality of vertical conductive interconnects comprising a plurality of vertical column interconnects, wherein each pixel column is coupled to a selected one of the vertical column interconnects.