| 发明名称 | Housing and method for making same | ||
| 摘要 | A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided. | ||
| 申请公布号 | US9232659(B2) | 申请公布日期 | 2016.01.05 |
| 申请号 | US201314098685 | 申请日期 | 2013.12.06 |
| 申请人 | FIH (Hong Kong) Limited | 发明人 | Chiang Chwan-Hwa;Wang Chieh-Hsiang |
| 分类号 | H05K3/00;H05K1/02;H05K1/16;H05K3/46;H04M1/02 | 主分类号 | H05K3/00 |
| 代理机构 | Novak Druce Connolly Bove + Quigg LLP | 代理人 | Novak Druce Connolly Bove + Quigg LLP |
| 主权项 | 1. A housing for an electronic device, comprising: a ceramic base comprising ceramic material, the ceramic base defining a receiving area and comprising an inner surface facing the receiving area; at least one electronic element embedded in the ceramic base; and a buffer layer formed on and in contact with the inner surface, the buffer layer made of resin; wherein the ceramic material is a mixture of ZrO2, In2O3, and Al2O3; in the mixture, the ZrO2 has a weight percentage of about 85% to about 91%, the In2O3 has a weight percentage of about 8% to about 13%, and the Al2O3 has weight percentage of about 1% to about 2%. | ||
| 地址 | Kowloon HK | ||