Semiconductor device manufacturing method and semiconductor device

摘要

There is provided a technology by which the position of 1 pin in a tabless package can be recognized easily. The rear surfaces of plural leads are exposed on a rear surface of a resin-sealed body which seals a semiconductor chip etc., a image recognition area is further provided adjacent to 1 pin (lead with index 1), and a rear surface of an identification mark is exposed from the rear surface of the resin-sealed body of the image recognition area. This identification mark is made of the same conductive member as the plural leads.

主权项

1. A semiconductor device manufacturing method, comprising the steps of:
(a) preparing a lead frame which has arranged a plurality of unit frames having a square holding frame made of a conductive member surrounding a chip mounting region, a plurality of leads having a first thickness made of the conductive member coupled to and held by the holding frame, a suspension lead having a second thickness smaller than the first thickness made of the conductive member coupled to and held by the holding frame, and an identification mark having the first thickness made of the conductive member held by the suspension lead; (b) preparing a semiconductor wafer having a first principal surface, a plurality of chip regions arranged on the first principal surface, cutting regions arranged between mutually adjacent chip regions among the plurality of chip regions, and a second principal surface on the opposite side of the first principal surface; (c) attaching a resin sheet to the second principal surface of the semiconductor wafer; (d) after the step (c), cutting the semiconductor wafer and the resin sheet along the cutting regions to obtain semiconductor chips having a part of the resin sheet; (e) after the step (d), fixing the lead frame to a top surface of a frame tape arranged on a front surface of a heat stage, arranging the semiconductor chips in the chip mounting regions of the unit frame configuring the lead frame via the part of the resin sheet, and fixing the semiconductor chip to the top surface of the frame tape; (f) after the step (e), electrically connecting a plurality of electrode pads of the semiconductor chips and the front surfaces of the plurality of leads via a plurality of conductive wires; (g) after the step (f), forming a sealed body by sealing the semiconductor chip, the plurality of conductive wires, the front and side surfaces of the plurality of leads, the suspension lead, the front and side surfaces of the identification mark, and the top surface of the frame tape with a resin; (h) after the step (g), peeling the frame tape from the sealed body to expose the rear surfaces of the plurality of leads and the rear surface of the identification mark from the rear surface of the sealed body; and (i) after the step (h), cutting the sealed body, the plurality of leads, and the suspension lead to obtain individual semiconductor devices, wherein the frame is configured of a first holding part and a third holding part which are separated from each other and provided to extend in a first direction, and a second holding part and a fourth holding part are separated from each other and provided to extend in a second direction intersecting at right angles with the first direction, wherein the first holding part and the second holding part, the second holding part and the third holding part, the holding part and the fourth holding part, and the fourth holding part and the first holding part are respectively coupled with each other, and wherein the identification mark is disposed in a vicinity of a coupled portion of the first holding part and the second holding part only, and is not located in a vicinity of a coupled portion of the second holding part and the third holding part, a coupled portion of the third holding part and the fourth holding part, and a coupled portion of the fourth holding part and the first holding part.