发明名称 |
Polishing pad |
摘要 |
The purpose of the present invention is to provide a laminated polishing pad that can be flatly bonded to a polishing platen even if it is large in size. This laminated polishing pad, comprising a polishing layer and a support layer with an adhesive member interposed therebetween, wherein the polishing layer contains 0.5 to 5% by weight of a hydrophilic substance; the support layer is a layer obtained by integrally molding a cushion layer and a resin film having a thermal dimensional change rate of 1.3 to 12.6%; the laminated polishing pad has a concavely warped form in the polishing layer side; and the laminated polishing pad has an average warp amount of 3 to 50 mm at the peripheral edge of the pad. |
申请公布号 |
US9227296(B2) |
申请公布日期 |
2016.01.05 |
申请号 |
US201214367743 |
申请日期 |
2012.12.06 |
申请人 |
TOYO TIRE & RUBBER CO., LTD. |
发明人 |
Kazuno Atsushi |
分类号 |
B24D11/00;B24B37/22;B24D18/00;H01L21/304 |
主分类号 |
B24D11/00 |
代理机构 |
Law Office of Katsuhiro Arai |
代理人 |
Law Office of Katsuhiro Arai |
主权项 |
1. A laminated polishing pad, comprising a polishing layer and a support layer with an adhesive member interposed therebetween, wherein
the polishing layer contains 0.5 to 5% by weight of a hydrophilic substance; the support layer is a layer obtained by integrally molding a cushion layer and a resin film having a thermal dimensional change rate of 1.3 to 12.6%; the laminated polishing pad has a concavely warped form in the polishing layer side; and the laminated polishing pad has an average warp amount of 3 to 50 mm at the peripheral edge of the pad. |
地址 |
Osaka JP |