SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

A semiconductor device has a semiconductor chip, a signal lead that is arranged in a periphery of the semiconductor chip and has a main surface and a rear surface opposed to the main surface, a wire that electrically connects the semiconductor chip and the main surface of the signal lead, and a sealing body made of sealing resin that seals the semiconductor chip, the signal lead and the wire. The signal lead has, in an extending direction of the signal lead, one end located inside the sealing body, the other end located outside the sealing body, and a wire connection region which is the main surface of the signal lead and to which the wire is connected, and an inner groove is provided in the main surface of the signal lead between the one end and the wire connection region.

主权项

1. A semiconductor device, comprising:
a semiconductor chip; a lead that is arranged in a periphery of the semiconductor chip and has a main surface and a rear surface opposed to the main surface; a wire that is connected to the main surface of the lead and electrically connects the semiconductor chip and the lead; and a sealing body in which the semiconductor chip, the lead and the wire are covered with sealing resin, wherein the lead has, in an extending direction of the lead, one end located inside the sealing body, the other end located outside the sealing body and a wire connection part to which the wire is connected, and the lead has a first groove in the main surface between the one end and the wire connection part.