Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad

摘要

The present disclosure provides a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench in the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench is electrically connect to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board is also provided.

主权项

1. A printed circuit board, comprising:
a substrate having an upper surface; a first trench depressed in the upper surface of the substrate; a first via disposed in the first trench, and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, wherein the first via is electrically connected to the first trench.