发明名称 |
FLIP CHIP BONDER AND FLIP CHIP BONDING METHOD |
摘要 |
Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality. |
申请公布号 |
US2015380381(A1) |
申请公布日期 |
2015.12.31 |
申请号 |
US201514847295 |
申请日期 |
2015.09.08 |
申请人 |
Shinkawa Ltd. |
发明人 |
SEYAMA Kohei |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A flip chip bonder comprising:
a flip mechanism configured to flip a chip; a bonding tool configured to receive the chip flipped by the flip mechanism from the flip mechanism and to bond the received chip to a substrate; and a cooling mechanism configured to cool the flip mechanism. |
地址 |
Tokyo JP |