| 发明名称 |
METHOD OF MAKING A SYSTEM-IN-PACKAGE DEVICE, AND A SYSTEM-IN-PACKAGE DEVICE |
| 摘要 |
A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer. |
| 申请公布号 |
US2015375996(A1) |
申请公布日期 |
2015.12.31 |
| 申请号 |
US201514845926 |
申请日期 |
2015.09.04 |
| 申请人 |
MURATA ELECTRONICS OY |
发明人 |
KUISMA Heikki |
| 分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A system-in-package device, comprising
at least one first species die, at least one second species die, at least one further component of the system-in-package device; at least one of the first and second species dies being included in a redimensioned die structure formed by solid material added to at least one side of the die; a connecting layer on the redimensioned die structure; a non-selected die and the at least one further component mounted in contact with the redimensioned die structure via the connecting layer. |
| 地址 |
Vantaa FI |
