| 摘要 |
The present invention relates to a device and a method to cut a wafer by using a laser and, more specifically, to a device and a method to cut a wafer by using a laser, capable of cutting a wafer to form a cut surface with an inclination angle by obliquely inputting a laser beam on the wafer, adjusting the inclination angle of the cut surface as necessary, efficiently cutting the wafer by freely controlling a focal distance of the incident laser beam, and precisely cutting the wafer by monitoring the cutting process without distortion. The wafer cutting device includes: a laser light source unit generating the laser beam to cut the wafer; an optical unit changing a path of the laser beam, generated from the laser light source unit, a mirror unit controlling an incident angle of the laser beam, of which path is changed by the optical unit, to obliquely cut the wafer; and a stage on which the wafer to be cut is placed. According to the device and the method to cut a wafer by using a laser, the cut surface of the wafer is obliquely cut to have an inclination angle. The inclination angle of the cut surface is controlled as necessary. The efficiency of cutting is raised by controlling the focal distance of the incident laser beam and the wafer is precisely cut by monitoring the cutting process without distortion. |
