| 摘要 |
THE INVENTION RELATES TO A METHOD FOR THE SIMULTANEOUS MATERIAL-REMOVING PROCESSING OF BOTH SIDES OF AT LEAST THREE SEMICONDUCTOR WAFERS (36) BETWEEN TWO ROTATING RING-SHAPED WORKING DISKS (31 AND 32) OF A DOUBLE-SIDE PROCESSING APPARATUS, WHEREIN THE DOUBLE-SIDE PROCESSING APPARATUS HAS A ROLLING APPARATUS, WHICH CAUSES AT LEAST THREE CARRIERS (13) TO ROTATE, AND WHEREIN EACH OF THE CARRIERS (13) HAS PRECISELY ONE OPENING (1), INTO WHICH A SEMICONDUCTOR WAFER (36) IS RESPECTIVELY INSERTED IN A FREELY MOVABLE FASHION, SUCH THAT THE SEMICONDUCTOR WAFERS (36) ARE MOVED ON A CYCLOIDAL TRAJECTORY BETWEEN THE WORKING DISKS (31 AND 32), WHEREIN THE ARRANGEMENT OF THE CARRIERS (13) IN THE DOUBLE-SIDE PROCESSING APPARATUS AND OF THE OPENINGS (1) IN THE CARRIERS (13) IS SUCH THAT THE INEQUALITY R/E?SIN (?/N*) ? R/E ? 1 ? 1.2 IS SATISFIED, WHERE N* DENOTES THE RATIO OF THE ROUND ANGLE AND THE ANGLE AT WHICH THE ADJACENT CARRIERS (13) ARE INSERTED INTO THE ROLLING APPARATUS WITH THE GREATEST DISTANCE WITH RESPECT TO ONE ANOTHER, R DENOTES THE RADIUS OF AN OPENING (1) FOR RECEIVING A SEMICONDUCTOR WAFER (36), E DENOTES THE RADIUS OF THE PITCH CIRCLE (2) AROUND THE MIDPOINT OF THE CARRIER (13) ON WHICH THE OPENING (1) IS ARRANGED, AND R DENOTES THE RADIUS OF THE PITCH CIRCLE (2) ON WHICH THE CARRIERS (13) MOVE BETWEEN THE WORKING DISKS (31 AND 32) BY MEANS OF THE ROLLING APPARATUS. |
