CHIP COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME

摘要

A chip coil component may include: a ceramic body including a plurality of insulating layers and having a bottom surface provided as a mounting surface and a top surface opposing the bottom surface, an internal coil part disposed in the ceramic body and having first and second lead-out portions exposed to both end surfaces of the ceramic body in a length direction thereof, an external electrode disposed on the bottom surface of the ceramic body, and plating spreading parts formed on both end surfaces of the ceramic body in the length direction and connecting the first and second lead-out portions and the external electrode to each other.

主权项

1. A chip coil component comprising:
a ceramic body including a plurality of insulating layers and having a bottom surface provided as amounting surface and a top surface opposing the bottom surface; an internal coil part disposed in the ceramic body and having first and second lead-out portions exposed to end surfaces of the ceramic body in a length direction of the ceramic body; an external electrode disposed on the bottom surface of the ceramic body; and plating spreading parts formed on the end surfaces of the ceramic body in the length direction and connecting the first and second lead-out portions and the external electrode to each other.