| 摘要 |
1,106,607. Severing by grinding. SOCIETE D'ELECTRONIQUE ET D'AUTOMATISME. 4 Jan., 1967 [5 Oct., 1966], No. 461/67. Heading B3D. In a machine for sawing a sample 7 of brittle material, e.g. quartz, ceramic or simple or complex crystals e.g. semi-conductors, by a reciprocating array of metal wires 1 in the presence of an abrasive, the wires being located in grooves in wire guides 4, 5, 6 one of which is driven alternately in opposite directions, the grooves have walls which along part of their depth are substantially parallel to one another. The bottom of the groove is preferably triangular, Fig. 4, but may be trapezoidal or semi-elliptical. |
