| 发明名称 |
FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS |
| 摘要 |
The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates. |
| 申请公布号 |
US2015376795(A1) |
申请公布日期 |
2015.12.31 |
| 申请号 |
US201514796459 |
申请日期 |
2015.07.10 |
| 申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
Chow Andy Lok-Fung;Yee Dennis Kwok-Wai;Li Crystal P. L. |
| 分类号 |
C23C18/40;H05K3/18 |
主分类号 |
C23C18/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
Marlborough MA US |
