SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A purpose of the present invention is to perform a semiconductor package having an excellent heat radiation characteristic, and high reliability. The semiconductor package includes: a support substrate; a semiconductor device bonded via an adhesive to a surface of the support substrate; an insulating layer for covering the semiconductor device; and a wiring for connecting the semiconductor device and an external terminal by penetrating the insulating layer. A first aperture for reaching the semiconductor device is provided in a rear surface side of the support substrate. The adhesive may form a part of the first aperture.