IMAGE PICKUP ELEMENT MOUNTING SUBSTRATE AND IMAGE PICKUP DEVICE

摘要

Provided are an image pickup element mounting substrate which makes it possible to reduce the inclination of an image pickup device due to an electronic component, and an image pickup device using the image pickup element mounting substrate. An image pickup element mounting substrate (1) is provided with: a frame body (2) which is formed from an insulation layer and has a through-hole (2a) in an inner portion thereof; an electronic component (22) which is mounted on the lower surface side of the frame body (2); and a flat plate (4) which is provided on the lower surface of the frame body (2) so as to cover an opening of the through-hole (2a) with a part thereof being in non-contact with the electronic component (22), and has an image pickup element mounting part (11) in a region surrounded by the frame body (2) of the upper surface thereof, and the lower surface of the electronic component (22) is located higher than the lower surface of the flat plate (4).