发明名称 |
BONDING PAD FOR PRINTED CIRCUIT BOARD AND SEMICONDUCTOR CHIP PACKAGE USING SAME |
摘要 |
A bonding pad used for connecting a semiconductor chip to a printed circuit board includes: a copper layer, an organic layer, and a gold layer. The organic layer is formed between the copper layer and the gold layer. A part of the copper layer and a part of the gold layer are directly connected to each other. |
申请公布号 |
KR20150145703(A) |
申请公布日期 |
2015.12.30 |
申请号 |
KR20150084544 |
申请日期 |
2015.06.15 |
申请人 |
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
发明人 |
JEONG, JIN;CHUNG, CHRIS;CHOI, DEOG SOON;LEE, YOUNG HO;CHOI, YONG IK |
分类号 |
H01L23/373;H01L21/3205;H01L23/485;H01L23/495 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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