发明名称 Electronic device signal routing structures with conductive adhesive
摘要 An electronic device may have structures that are coupled together using conductive adhesive such as anisotropic conductive film and other adhesives. The structures that are coupled together may include a touch sensor structure formed from electrodes on the inner surface of a display cover layer, a display module having display layers such as a thin-film transistor layer, and circuitry mounted on substrates such as printed circuits. Conductive signal path structures may be used in routing signals within the electronic device. The conductive signal path structures may be formed from pins that are embedded within injection molded plastic, from metal traces such as laser-deposited metal traces that are formed on the surface of a plastic member or other dielectric, from metal structures that run within channels in a plastic, printed circuit traces, and other signal path structures.
申请公布号 US9223424(B2) 申请公布日期 2015.12.29
申请号 US201313858746 申请日期 2013.04.08
申请人 Apple Inc. 发明人 de Jong Erik G.;Shedletsky Anna-Katrina;Rothkopf Fletcher R.
分类号 G06F3/041;G02F1/1345;G02F1/1335;G02F1/1333 主分类号 G06F3/041
代理机构 Treyz Law Group, P.C. 代理人 Treyz Law Group, P.C. ;Treyz G. Victor;Guihan Joseph F.
主权项 1. An apparatus, comprising: signal path structures having metal structures that convey signals and a rigid plastic member that supports the metal structures; a display layer having metal traces coupled to the metal structures with anisotropic conductive film; a printed circuit; conductive traces in the printed circuit that are coupled to the metal structures with anisotropic conductive film; and a light guide plate that is mounted on and supported by the rigid plastic member.
地址 Cupertino CA US