发明名称 Actinic ray-sensitive or radiation-sensitive resin composition, resist film, and pattern-forming method using the same
摘要 Provided is an actinic ray-sensitive or radiation-sensitive resin composition, a resist film formed with the composition, and a pattern-forming method using the same. The actinic ray-sensitive or radiation-sensitive resin composition includes (P) a resin that contains the following repeating units (A), (B) and (C); and a solvent having a boiling temperature of 150° C. or less, (A) a repeating unit containing a group capable of decomposing and forming an acid upon irradiation with an actinic ray or radiation,(B) a repeating unit containing a group capable of decomposing and forming a carboxylic acid by the action of an acid, and(C) a repeating unit containing a carbon-carbon unsaturated bond.
申请公布号 US9223204(B2) 申请公布日期 2015.12.29
申请号 US201213669530 申请日期 2012.11.06
申请人 FUJITSU Corporation 发明人 Ito Takayuki;Takahashi Hidenori;Tsuchimura Tomotaka;Kataoka Shohei;Inasaki Takeshi
分类号 G03F7/039;G03F7/20;G03F7/004 主分类号 G03F7/039
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. An actinic ray-sensitive or radiation-sensitive resin composition comprising: (P) a resin that contains the following repeating units (A), (B) and (C); and a solvent having a boiling temperature of 150° C. or less, (A) a repeating unit containing a group capable of decomposing and forming an acid upon irradiation with an actinic ray or radiation,(B) a repeating unit containing a group capable of decomposing and forming a carboxylic acid by the action of an acid, and(C) a repeating unit containing a carbon-carbon unsaturated bond, wherein the repeating unit (A) has on the side chain a group capable of decomposing and generating an acid upon irradiation with an actinic ray or radiation and the acid comprises a group represented by any one of the following structures: —CH2—SO3H, —CH2—CF2—CF2—SO3H, —OCO—CF2—SO3H, —CHF—CF2—SO3H, —CH2—SO2—NH—SO2—CF3, and —CF2—SO2—NH—SO2—CF3, wherein the compositional amount (mol) of the repeating unit (B) and the repeating unit (C) in the resin (P) satisfies a relationship of the repeating unit (B)≦the repeating unit (C).
地址 Tokyo JP
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