发明名称 |
Semiconductor device |
摘要 |
A semiconductor device includes an AC coupling element, and a temperature monitoring unit that outputs a temperature monitor signal, the temperature monitoring unit has a first temperature monitoring element that outputs the temperature monitor signal, and the first temperature monitoring element is arranged in a region immediately below or a region adjacent to the AC coupling element. |
申请公布号 |
US9224670(B2) |
申请公布日期 |
2015.12.29 |
申请号 |
US201313958595 |
申请日期 |
2013.08.04 |
申请人 |
Renesas Electronics Corporation |
发明人 |
Kaeriyama Shunichi |
分类号 |
H01L23/34;H01L23/00;H01L23/64;H01L25/065;H01L23/62;H01L25/16 |
主分类号 |
H01L23/34 |
代理机构 |
Miles & Stockbridge P.C. |
代理人 |
Miles & Stockbridge P.C. |
主权项 |
1. A semiconductor device, comprising:
an AC coupling element that is formed on a semiconductor substrate; a temperature monitoring unit that outputs a temperature monitor signal in response to a change in a temperature of the semiconductor substrate; a heat generation determination unit that outputs a heat generation detection signal on the basis of the temperature monitor signal; a power supply pad that applies a supply voltage; and a transmitter circuit that is connected to the AC coupling element, wherein the temperature monitoring unit includes a first temperature monitoring element that outputs the temperature monitor signal, wherein the first temperature monitoring element is arranged in a region immediately below or a region adjacent to the AC coupling element, wherein the heat generation determination unit includes a comparator, wherein the comparator outputs the heat generation detection signal on the basis of a comparison result between a reference voltage and the temperature monitor signal, and wherein a resistance value of a power supply line between the power supply pad and the comparator is smaller than a resistance value between the power supply pad and the transmitter circuit. |
地址 |
Tokyo JP |