发明名称 Semiconductor device
摘要 A semiconductor device includes an AC coupling element, and a temperature monitoring unit that outputs a temperature monitor signal, the temperature monitoring unit has a first temperature monitoring element that outputs the temperature monitor signal, and the first temperature monitoring element is arranged in a region immediately below or a region adjacent to the AC coupling element.
申请公布号 US9224670(B2) 申请公布日期 2015.12.29
申请号 US201313958595 申请日期 2013.08.04
申请人 Renesas Electronics Corporation 发明人 Kaeriyama Shunichi
分类号 H01L23/34;H01L23/00;H01L23/64;H01L25/065;H01L23/62;H01L25/16 主分类号 H01L23/34
代理机构 Miles & Stockbridge P.C. 代理人 Miles & Stockbridge P.C.
主权项 1. A semiconductor device, comprising: an AC coupling element that is formed on a semiconductor substrate; a temperature monitoring unit that outputs a temperature monitor signal in response to a change in a temperature of the semiconductor substrate; a heat generation determination unit that outputs a heat generation detection signal on the basis of the temperature monitor signal; a power supply pad that applies a supply voltage; and a transmitter circuit that is connected to the AC coupling element, wherein the temperature monitoring unit includes a first temperature monitoring element that outputs the temperature monitor signal, wherein the first temperature monitoring element is arranged in a region immediately below or a region adjacent to the AC coupling element, wherein the heat generation determination unit includes a comparator, wherein the comparator outputs the heat generation detection signal on the basis of a comparison result between a reference voltage and the temperature monitor signal, and wherein a resistance value of a power supply line between the power supply pad and the comparator is smaller than a resistance value between the power supply pad and the transmitter circuit.
地址 Tokyo JP