Composite substrate for layered heaters

摘要

A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater to the heater substrate after the heater substrate is secured to the application substrate. The application of the layered heater includes applying a first dielectric layer onto the heater substrate, applying a resistive heating layer onto the first dielectric layer, and applying a second dielectric layer onto the resistive heating layer. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of at least one of the first dielectric layer and a coefficient of thermal expansion of the resistive heating layer.

主权项

1. A method of forming a heater assembly for use in semiconductor processing comprising the following steps in sequence:
thermally securing a heater substrate to an application substrate using a joining process selected from the group consisting of brazing, welding, soldering, diffusion bonding, epoxying, and vulcanizing; applying a layered heater to the heater substrate after the heater substrate is secured to the application substrate, the application of the layered heater comprising:
applying a first dielectric layer onto the heater substrate;applying a resistive heating layer onto the first dielectric layer; andapplying a second dielectric layer onto the resistive heating layer, wherein the heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of at least one of the first dielectric layer and a coefficient of thermal expansion of the resistive heating layer.