发明名称 Method of making a flexible circuit
摘要 A method of manufacturing a multilayer flexible circuit comprises providing first and second flexible substrates, each comprising a conductor layer and an insulator layer. The conductor layer of the first substrate is a patterned conductor layer. The first and second substrates are laminated together using a double belt press through which the substrates move in a continuous process. The method may include patterning the conductor layer of the first substrate and/or the conductor layer of the second substrate using an etching method that includes exposing a dry film resist on the conductor layer to a pattern by carrying out a plurality of exposures of adjacent and/or overlapping areas.
申请公布号 US9226410(B2) 申请公布日期 2015.12.29
申请号 US201314375824 申请日期 2013.01.24
申请人 TRACKWISE DESIGNS LIMITED 发明人 Johnston Philip
分类号 H05K3/46;H05K1/02;H05K1/11;B32B37/10;H05K3/06 主分类号 H05K3/46
代理机构 Hodgson Russ LLP 代理人 Hodgson Russ LLP
主权项 1. A method of manufacturing a multilayer flexible circuit, comprising: providing first and second flexible substrates, each comprising a conductor layer and an insulator layer, the conductor layer of the first substrate being a patterned conductor layer; fixing together the first and second substrates; laminating the fixed first and second substrates together using a double belt press through which the substrates move in a continuous process; and patterning the conductor layer of the first substrate, the second substrate, or the first substrate and the second substrateby: laminating a resist onto the conductor layer;exposing the resist to a pattern, wherein exposing comprises carrying out a plurality of exposures over adjacent areas of the resist layer, which adjacent exposures together define a single circuit;developing the resist;etching the conductor layer, thereby patterning it in correspondence to the developed resist; andstripping the resist layer.
地址 Gloucestershire GB