发明名称 SUBSTRATE WITH ELECTRONIC DEVICE EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF
摘要 According to the present invention, an electronic device embedded substrate and a manufacturing method thereof are disclosed. According to an aspect of the present invention, the electronic device embedded substrate comprises: an electronic device; and a core substrate having a cavity, in which the electronic device is embedded and of which a width of a portion gets narrower.
申请公布号 KR20150144587(A) 申请公布日期 2015.12.28
申请号 KR20140073584 申请日期 2014.06.17
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, TAE SEONG;YU, YEON SEOP;LEE, BOK HEE
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
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