发明名称 |
SUBSTRATE WITH ELECTRONIC DEVICE EMBEDDED THEREIN AND MANUFACTURING METHOD THEREOF |
摘要 |
According to the present invention, an electronic device embedded substrate and a manufacturing method thereof are disclosed. According to an aspect of the present invention, the electronic device embedded substrate comprises: an electronic device; and a core substrate having a cavity, in which the electronic device is embedded and of which a width of a portion gets narrower. |
申请公布号 |
KR20150144587(A) |
申请公布日期 |
2015.12.28 |
申请号 |
KR20140073584 |
申请日期 |
2014.06.17 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, TAE SEONG;YU, YEON SEOP;LEE, BOK HEE |
分类号 |
H05K3/46;H05K1/18 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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