| 摘要 |
A method for inspecting a contact mark of a wafer bump pad includes the following steps: focusing a camera on top of a protruding bump pad while radiating light to the bump pad, on one side of a wafer, having a contact mark in contact with a probe card for inspecting an electric performance; filming the bump pad in the shade with the camera focused on the bump pad to obtain an image; and determining whether or not the contact of the probe card is normally attained based on whether or not a bright part of the image is included within an effective region including the bump pad by checking the obtained image. |
