METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE

摘要

The present invention includes a step of arranging light emitting structures where a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer are formed on a support substrate; a step of attaching a transparent substrate which is formed in the wavelength conversion regions corresponding to each of the light emitting structures, onto the light emitting structures; a step of removing the support substrate; and a step of removing at least part of the transparent substrate and dividing the substrate into individual semiconductor light emitting device packages.