THIN FILM RDL FOR NANOCHIP PACKAGE

摘要

A high density film adapted for nanochip package comprises three redistribution layers. A bottom redistribution circuit has a plurality of first bottom pads adapted for a nanochip to mount; and has a plurality of first top pads. The density of the first bottom pads is higher than the density of the first top pads. A middle redistribution circuit has a plurality of second bottom pads electrically coupled to the first top pads; and has a plurality of second top pads. The density of the second bottom pads is higher than the density of the second top pads. A top redistribution circuit has a plurality of third bottom pads electrically coupled to the second top pads; and has a plurality of third top pads. The density of the third bottom pads is higher than the density of the third top pads.

主权项

1. A thin film RDL for nanochip package, comprising:
a bottom redistribution circuit, having a plurality of first bottom pads adapted for at least one nanochip to mount; and having a plurality of first top pads; wherein a density of the first bottom pads is higher than a density of the first top pads; a middle redistribution circuit formed on top of the bottom redistribution circuit, having a plurality of second bottom pads electrically coupled to the first top pads, and having a plurality of second top pads; wherein a density of the second bottom pads is higher than a density of the second top pads; and a top redistribution circuit formed on top of the middle redistribution circuit, having a plurality of third bottom pads electrically coupled to the second top pads, and having a plurality of third top pads; wherein a density of the third bottom pads is higher than a density of the third top pads.