| 摘要 |
An embodiment of the present invention includes: a substrate; multiple light emitting cells placed on the substrate separately, including a first conductive semiconductor, an active layer, and a second conductive semiconductor, and having a via hole formed from the surface of the second conductive semiconductor layer to a part of the first conductive semiconductor layer via the active layer; a first electrode layer electrically connected from the bottom surface of the via hole to the first conductive semiconductor layer; a second electrode layer placed on an upper part of the second conductive semiconductor layer; and a first passivation layer electrically separating the first and second electrode layers. The first electrode layer provides a light emitting layer electrically connected to the second electrode layer of the light emitting cell, adjacent to the light emitting cell. The efficiency of light emitting is increased by improving the efficiency of light extraction on a front surface of a light emitting element by using the first passivation layer and the first electrode layer, formed on the substrate between the light emitting cells and the upper surface of the light emitting cells. |
