发明名称 PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a processing device capable of preventing the collision of a restriction part for restricting a wafer position with the outer periphery of the wafer, when holding the wafer to carry into a chuck table.SOLUTION: Three restriction pins 64 are configured to be capable of advancing or retracting between an action position to the slightly lateral of the outer periphery of a wafer W, having a lower end held by a hold member 61, and a retraction position upward of and apart from the wafer W held by the hold member 61. At the carriage of the wafer W out of a temporary placing table, a bump part retracts the restriction pins 64 upward, to thereby enable preventing the restriction pin 64 from colliding with the wafer W before held by the hold member 61. At the carriage of the wafer W into the chuck table 20, the restriction pins 64 restrict the movement of the wafer W to the plane direction.
申请公布号 JP2015233070(A) 申请公布日期 2015.12.24
申请号 JP20140119106 申请日期 2014.06.09
申请人 DISCO ABRASIVE SYST LTD 发明人 MURATA KENJI;GOTO TOSHIMITSU
分类号 H01L21/677;B65G49/07;H01L21/304 主分类号 H01L21/677
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