| 摘要 |
An electric element package is provided including an electrode formed on an element substrate and made of alloy whose main component is Al or Ag, an ITO layer formed on the electrode, an electric element formed on the electrode, a sealing substrate arranged so as to face the element substrate, and a glass frit formed between the sealing substrate and the ITO layer, the glass fit having a portion that contacts the ITO layer and a portion that contacts the sealing substrate, where the portion of the glass frit that contacts the ITO layer has width that is 50 to 80 percent of the portion of the glass frit that contacts the sealing substrate. |
